Coreless RF-SiP Substrate

产品(技术)的特点及优点

SiP(System in Package)

将几个IC和Passive Component封装在一起成为一个系统，用该系统实现复合功能。

General Features

● Smaller Package size compared to individually-packaged Ics

● 散热特性

Application
● PA(Power Amplifier), PAD(Power Amplifier Duplexer)

● FEMID (Front-end module with integrated duplexer)

●  SAW Filter, BAW Filter
● Diversity FEM、Switch等各种RF配件

Why Samsung

Thin Ni ENEPIG

Selective ENEPIG